IBM Power9 PN: 9223-22H – Feature Code H922

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IBM Power9 PN: 9223-22H - Feature Code H922

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IBM Power9 PN: 9223-22H - Feature Code H922
IBM Power9 PN: 9223-22H - Feature Code H922

Home / Shop / IBM / Lenovo / Servers (IBM / Lenovo) / Power

IBM Power9 PN: 9223-22H - Feature Code H922

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Model Number: 9223-22H

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Categories: Power
Manufacturer: IBM
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  • Description
  • Specifications
IBM Part Number: 9223-22H

This PN provides one IBM Power9 for SAP HANA.

Power9 H922 (MTM 9223-22H)server features:
POWER9 processor modules:
- 4-core typical 2.8 - 3.8 GHz (maximum) POWER9 processor
- 8-core typical 3.4 - 3.9 GHz (maximum) POWER9 processor
- 10-core typical 2.9 - 3.8 GHz (maximum) POWER9 processor
High-performance Mbps DDR4 ECC memory:
- 8 GB, 16 GB, 32 GB, 64 GB, or 128 GB memory features. Different sizes/configurations run at different frequencies of 2133, 2400, and 2666
- Up to 4 TB of DDR4 memory with two POWER processors.
- Up to 2 TB of DDR4 memory with one POWER processor.
Storage feature: Eight SFF bays, one integrated SAS controller without cache, and JBOD RAID 0, 5, 6, or 10.
Optionally, split the SFF-3 bays and add a second integrated SAS controller without cache:
- Expanded Function Storage Backplane 8 SFF-3 Bays/Single IOA with Write Cache.
- Optionally, attach an EXP12SX/EXP24SX SAS hard disk drive (HDD)/solid-state drive (SSD) Expansion Drawer to the single IOA.
Up to two PCIe3 NVMe carrier cards with two M.2 module slots (with up to four Mainstream 400 GB SSD NVMe M.2 modules). One PCIe3 NVMe carrier card can be ordered only with a storage backplane. If a PCIe3 NVMe carrier card is ordered without a storage backplane, then the optional split feature is not supported.
Peripheral Component Interconnect Express (PCIe) slots with single processor:
- One x16 Gen4 low-profile, half-length (Coherent Accelerator Processor Interface (CAPI)).
- One x8 Gen4 low-profile, half-length (with x16 connector) (CAPI).
- Two x8 Gen3 low-profile, half-length (with x16 connectors).
- Two x8 Gen3 low-profile, half-length. (One of these slots is used for the required base LAN adapter.)
PCIe slots with two processors:
- Three x16 Gen4 low-profile, half-length (CAPI).
- Two x8 Gen4 low-profile, half-length (with x16 connectors) (CAPI).
- Two x8 Gen3 low-profile, half-length (with x16 connectors).
- Two x8 Gen3 low-profile, half-length. (One of these slots is used for the required base LAN adapter.)
Integrated:
- Service processor.
- EnergyScale technology.
- Hot-plug and redundant cooling.
- Two front USB 3.0 ports.
- Two rear USB 3.0 ports.
- Two Hardware Management Console (HMC) 1 GbE RJ45 ports.
- One system port with an RJ45 connector.
- Two hot-plug, redundant power supplies.
- 19-inch rack-mounting hardware (2U).

IBM Power Systems are engineered for the most rigorous and data-intensive computing tasks on the planet. These servers, primed for cloud deployment, empower you to extract valuable insights from your data flow - whether it's overseeing mission-critical data, managing operational data repositories and reservoirs, or facilitating top-tier performance in cognitive computing.

With unmatched reliability and security measures, our infrastructure is crafted to effortlessly handle the most demanding data workloads imaginable, all while safeguarding your business interests.

The IBM Power System E950 presents a distinctive fusion of enterprise-grade functionalities within a dependable, space-saving 4-socket 4U form factor, delivering outstanding performance at a reasonable cost. Featuring two to four IBM POWER9 processors in configurations of eight, ten, eleven, or twelve cores, along with up to 16 TB of DDR4 memory, integrated PowerVM virtualization, and Capacity on Demand (CoD), no other 4-socket system in the industry matches this blend of per-core performance, effectiveness, and business adaptability.

Ideal for expanding medium-sized businesses or serving as a departmental server or foundational component for large enterprise data centers, the Power E950 offers an open, data-centric design characteristic of Power Systems. This design seamlessly integrates computing power, memory bandwidth, and extensive data pathways to facilitate the processing and movement of data across applications in a more accessible and manageable manner.

The Power E950 server optimizes throughput through the utilization of new POWER9 processors capable of supporting simultaneous multi-threading of up to eight threads per core (SMT8). Each Single Chip Module includes on-chip memory controllers and can leverage up to 128 MB off-chip eDRAM L4 cache, delivering a remarkable 230 GB/sec of memory bandwidth per socket. Additionally, I/O bandwidth sees a significant increase thanks to the integration of new PCIe Gen4 I/O controllers directly into the processors, further reducing latency.

As the cornerstone for a private cloud infrastructure capable of driving large-scale, mission-critical applications essential for leveraging data as a competitive advantage, the IBM Power E950 is tailored to meet your specific needs and comes equipped with enterprise-class security and efficient, integrated IBM PowerVM virtualization, ready for deployment.

Power System H922 (9223-22H) specs
MicroprocessorsUp to 2x POWER9 CPUs 4, 8, 10 cores
Level 2 (L2) cache per core512 K
Level 3 (L3) cache per core10 MB
RAM (memory)Up to 4 TB, from 32 DDR4 IS DIMM at 2666, 2400, and 2133 Mhz
Internal disk storageSFF bays, one integrated SAS controller without cache, and JBOD RAID 0, 5, 6, or 10
- Optionally, split the above SFF-3 bays and add a second integrated SAS controller without cache.
- Expanded Function Storage Backplane 8 SFF-3 Bays/Single IOA with Write Cache.
- Optionally, attach an EXP12SX/EXP24SX SAS HDD/SSD Expansion Drawer to the single IOA.
Processor-to-memory bandwidthUp to 172 GB/s per socket, 344 GB/s per system
L2 to L3 cache bandwidth7 TB/s on chip bandwidth
Adapter slotsOne x16 Gen4 low-profile, half-length slot (CAPI)
One x8 Gen4 low-profile, half-length slot (with x16 connector) (CAPI)
Two x8 Gen3 low-profile, half-length slots (with x16 connectors)
Two x8 Gen3 low-profile, half-length slots (one of these slots is used for the required base LAN adapter)
PCIe slots with two processors:
Three x16 Gen4 low-profile, half-length slots (CAPI)
Two x8 Gen4 low-profile, half-length slots (with x16 connectors) (CAPI)
Two x8 Gen3 low-profile, half-length slots (with x16 connectors)
Two x8 Gen3 low-profile, half-length slots (one of these slots is used for the required base LAN adapter)
Integrated Standard Features Adapter slotsService processor
EnergyScale technology
Hot-plug and redundant cooling
Two front USB 3.0 ports
Two rear USB 3.0 ports
Two HMC 1 GbE RJ45 ports
One system port with RJ45 connector
Two hot-plug, redundant power supplies
19-inch rack-mounting hardware (2U)
one High Speed 25 Gb/s per socket
Connectivity support (optional) I/O ports Standard featuresOne front USB 3.0 ports
Two rear USB 3.0 ports
Two HMC 1 GbE RJ45 ports
One system port with RJ45 connector
Advanced POWER VirtualizationPowerVM integrated
RAS featuresProcessor instruction retry
Selective dynamic firmware updates Chip kill memory
ECC L2 cache, L3 cache
Service processor with fault monitoring Hot-swappable disk bays
Redundant cooling fans
Operating systemsSUSE Linux Enterprise Server 12 Service Pack 3
SUSE Linux Enterprise Server for SAP with SUSE Linux Enterprise Server 11 Service Pack 4
SUSE Linux Enterprise Server for SAP with SUSE Linux Enterprise Server 12 Service Pack 3
Red Hat Enterprise Linux 7 for Power LE, 7.4
Red Hat Enterprise Linux for SAP with Red Hat Enterprise Linux 7 for Power LE, 7.4 Secondary: AIX 6.1, 7.1, 7,2 and IBM i 7.2, 7.3
Power requirementsOperating voltage: 1400 W PSU: 200 - 240 V AC Operating frequency: 47/63 Hz
System dimensionsWidth: 482 mm (18.97 in.)
Depth: 766.5 mm (30.2 in.)
Height: 86.7 mm (3.4 in.)
Weight: 30.4 kg (67 lb)